Chip Quik NC191LT50T5 Flow Low Temperature Solder Paste T5 50g Jar
Brand:
Chip Quik
Part #:
NC191LT50T5
Condition: 
Brand New
Brand NewChoose Alloy
$27.39 /Each
$27.95 You save $0.56 2%
Handling Purchases under $100.00 are subject to $15.00 handling fee.
4-6 Weeks Factory Lead Time
Check availability
$27.39 /Each
$27.95 You save $0.56 2%
Handling Purchases under $100.00 are subject to $15.00 handling fee.
Manufacturer warranty Description
Chip Quik, NC191LT50T5, Smooth Flow Low Temperature Solder Paste Sn42/Bi57.6/Ag0.4 T5 50g Jar
Features:
- Lead-Free
- RoHS 3 Compliant
- Smooth FlowTM Technology
- A lower-density flux vehicle for better shear spread and improved flow during heating
- Halogen Free (EN14582 test method)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Store refrigerated or at room temperature 3-25C (37-77F). Do not freeze. Allow 4 hours for flux to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Technical details
Main features
- Size 50g jar
- Alloy Sn42/Bi57.6/Ag0.4
- Flux Classification ROL0
- Particle Size T5 (15-25 microns)
- Version T5 50g Jar
- Shelf Life Refrigerated >6 months, unrefrigerated >2 months
- Melting Point 138C (281F)
- Flux Type Synthetic No-Clean
- Metal Content 89.25% metal by weight.
- Stencil Life >8 hours at 20-50% RH 22-28C (72-82F) >4 hours at 50-70% RH 22-28C (72-82F)
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