Chip Quik NC191LT10 Flow Low Temperature Solder Paste 3cc/10g Syringe
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Manufacturer warranty Description
Chip Quik, NC191LT10, Smooth Flow Low Temperature Solder Paste Sn42/Bi57.6/Ag0.4 T4 3cc/10g Syringe
Features:
- Lead-Free
- RoHS 3 Compliant
- Smooth FlowTM Technology
- A lower-density flux vehicle for better shear spread and improved flow during heating
- Halogen Free (EN14582 test method)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Store refrigerated or at room temperature 3-25C (37-77F). Do not freeze. Allow 4 hours for flux to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Technical details
- Size 3cc/10g syringe
- Alloy Sn42/Bi57.6/Ag0.4
- Flux Classification ROL0
- Particle Size T4 (20-38 microns)
- Version T4 3cc/10g Syringe
- Shelf Life Refrigerated >6 months, unrefrigerated >2 months
- Melting Point 138C (281F)
- Flux Type Synthetic No-Clean
- Metal Content 86.75% metal by weight.
- Stencil Life >8 hours at 20-50% RH 22-28C (72-82F) >4 hours at 50-70% RH 22-28C (72-82F)
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