Chip Quik, TC4-1G, Heat Sink Thermal Compound / Grease, Deep-Space Liquid Metal 79 W/mK, 1g/1cc Syringe
Features:
- Lead-Free
- RoHS 3 Compliant
- REACH Compliant
CHIPQUIK® Deep-Space Liquid Metal™ Thermal Compound. Liquid Metal, non-curing, flowable, thermally conductive heat sink compound. Pure Liquid Metal. Provides extremely high thermal conductivity of 79 W/mK, low bleed and high temperature stability. Electrically Conducting. Alloy contains Gallium and is not compatible with Aluminum Heat Sinks.
Application Instructions
Apply sparingly with provided tips. Thinly spread using provided squeegee. Deep-Space Liquid Metal™ is highly conductive and is designed to fill all small cracks and crevices in surfaces to achieve extremely high thermal conductivity. Deep-Space Liquid Metal™ is thermally and electrically conductive, avoid getting it on electrical pins/pads/traces/BGA balls.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.