Chip Quik, TC1-10G, Heat Sink Thermal Compound / Grease, High Density 10g Syringe 5cc, Paste
Features:
- Lead-Free
- RoHS 3 Compliant
- REACH Compliant
High Density Thermal Paste. White, non-curing and non-flowing thermally conductive heat sink compound. Heavily filled with heat-conductive metal oxide. Provides high thermal conductivity, low bleed and high temperature stability. Electrically insulating (2 x 10^15 ohm-cm).
Storage and Handling
Store refrigerated or at room temperature 3-25C (37-77F). Allow 4 hours for thermal paste to reach an application temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.