Buy Chip Quik SMDSWLF.006 5g, LF Solder Wire Sn96.5/Ag3/Cu0.5 .006 5g

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Buy in Bulk 4 Applicable Promotion(s)

Buy 50 pcs, get 7% off
Save 7% each on Chip Quik SMDSWLF.006 5g LF Solder Wire Sn96.5/Ag3/Cu0.5 .006 5g when you purchase 50 or more
Buy 25 pcs, get 5% off
Save 5% each on Chip Quik SMDSWLF.006 5g LF Solder Wire Sn96.5/Ag3/Cu0.5 .006 5g when you purchase 25 or more
Buy 10 pcs, get 3% off
Save 3% each on Chip Quik SMDSWLF.006 5g LF Solder Wire Sn96.5/Ag3/Cu0.5 .006 5g when you purchase 10 or more
Buy 5 pcs, get 1% off
Save 1% each on Chip Quik SMDSWLF.006 5g LF Solder Wire Sn96.5/Ag3/Cu0.5 .006 5g when you purchase 5 or more

Quantity

Options and Related Products

Chip Quik, SMDSWLF.006 5g, LF Solder Wire Sn96.5/Ag3/Cu0.5 No-Clean Water-Washable .006 5g, Ultra Thin

Features:

Lead-Free
RoHS 3 Compliant
REACH Compliant
No-Clean Water-Washable Synthetic Flux Core
The clear, non-corrosive, non-conductive residue is meant to be left on the board. Residues that do remain are water soluble if you want to remove them. Clean with hot water at 60C (140F) minimum.
1.2% flux core
Halogen content: None

We aim to show you accurate product information. Here you will find what the manufacturers have provided us with. See our disclaimer.

Technical Details

Alloy	Sn96.5/Ag3.0/Cu0.5
Diameter	0.004" (0.1mm)
Melting Point	217-220C (423-428F)
Flux	1.2% No-Clean Rosin-Activated Flux Core
Shelf Life	>60 months
IPC J-STD-004 Classification	REL0

Notes

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Alloy	Sn96.5/Ag3.0/Cu0.5
Diameter	0.004" (0.1mm)
Melting Point	217-220C (423-428F)
Flux	1.2% No-Clean Rosin-Activated Flux Core
Shelf Life	>60 months
IPC J-STD-004 Classification	REL0

Note: Please read description carefully. Do not base your order on the picture presented.