Chip Quik, EGS10W, Electronics Grade Silicone Adhesive Sealant, White, 10.2oz Cartridge
Features:
- Lead-Free
- RoHS 3 Compliant
- REACH Compliant
- Product Highlights
- Safe for Use With Electronics
- Meets the requirements of MIL 46106B Type 1
- Seals, Bonds, Encapsulates
- Resistant to Various Chemicals and Oils
- Tested to meet UL Approval Requirements for Horizontal Burn
- Tested to meet UL Approval Requirements for Mechanical Adhesion
- Non-Corrosive, Non-Conductive
- Flexible, Durable, Non-Degrading
- Withstands Moisture, Vibration, Abrasion
Common Uses
- Protecting, Sealing and Insulating Corrosion Sensitive Electronic Components and Electrical Materials.
- OEM Commercial and Industrial Manufacturing for Flexible Permanent Bonding and Sealing.
Instructions
Surfaces should be clean and dry. For detached nozzle cartridge, cut the tip off of the cartridge just above the nozzle threads. Thread nozzle onto cartridge and cut the tip off of the nozzle to the required bead size. Dispense by pushing the silicone in the direction of the nozzle with a cartridge dispensing gun. If tooling is required, do so within the first 10 minutes after dispensing. Apply the silicone to surfaces and remove the excess silicone after tooling with a dry clean cloth. Allow the silicone to cure completely. At room temperature, 25C (77F), and 50% relative humidity, the silicone will skin in 10 minutes and fully cure in 24 hours (1/8" bead). The silicone will reach its maximum adhesion in 7 days. Higher humidity accelerates curing.
Accelerating Curing Time
High humidity in combination with slightly elevated temperature will speed curing. Recommended Fast Cure Starting Point: Humidity of 95 to 100%, with temperature of 50 to 65C.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
