Chip Quik, CQB-AU100-23um, Gold Bonding Wire, Au100, Gold 23um, 0.9mil, Solid Core
Features:
- Lead-Free
- RoHS 3 Compliant
- REACH Compliant
High Purity Gold > 99.99% (4N). Designed specifically for wire bonding. Gold bonding wire is used to connect electrical components in many industries, including electronics, aerospace and medicine. Gold bonding wire has excellent electrical conductivity, stability and resistance to corrosion.
It is an important material in semiconductor and electronic device manufacturing. It is commonly used for wire bonding to electrically connect microchip semiconductor dies to the terminals of a chip package or directly to a substrate. Commonly used by integrated circuit (IC) packaging shops, research labs and advanced manufacturing facilities.
