Chip Quik BGA0034-SOCKET BGA-676 SMT Adapter, 1.0mm Pitch, 26x26 Grid

Features:

• BGA-676 (1.0 mm ball pitch, 26 x 26 pin array) to PGA-676 (0.1" pin pitch) adapter.
• ENIG finish. High temperature FR4 for leaded or lead-free reflow.
• PCB dimensions: 3.5" x 4.4" x 0.063" (88.90 mm x 111.76 mm x 1.6 mm)
• PCB construction: FR-4 UL94V-0. PCB operating temperature range: -40 °C to +130 °C. PCB reflow maximum temperature: +260 °C. PCB Assembly standard: IPC-A-610 Class II.
• Four corner mounting holes are 3.25 mm in diameter and accept 4-40 screws and stand-offs.
• Top side of board fits surface-mount footprint or accepts BGA Socket: Ironwood Electronics P/N: SG-BGA-6009. PCB mounting holes are designed to align with socket mounting bolts. NOTE: SOCKET NOT INCLUDED
• Through hole pin grid array is split into two halves and fully silkscreen labeled on top and bottom using the standard ball grid array numbering format.
• 1.0 mm diameter PGA holes accept round machine pins or square wire wrap pins.