Transcend TS1TMTE370T 1TB M.2 SSD PCIe NVMe Gen3 x4

Features:

• Firmware Features
  • Supports NVM command
  • SLC caching technology
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • TRIM command for better performance
  • NCQ command for better performance
• Hardware Features
  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Single-sided to fit perfectly in small form factor devices
  • Space-saving M.2 form factor (30mm) - ideal for mobile computing devices
  • PCIe Gen 3 x4 interface
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Key components fortified by default with Corner Bond technology
  • 30µ" PCB gold finger
  • Anti-sulfur technology implemented to prevent sulfurization in the environment
  • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
  • Promised operational reliability in an extended temperature range (from -20°C to 75°C)
  • Supports Transcend Scope Pro software

Technologies:

• 112-Layer 3D NAND Flash
• 30µ" PCB Gold Finger
• Corner Bond
• Extended Temperature
• Dynamic Thermal Throttling
• Thermal Sensor
• Read Disturbance
• Anti-Sulfur Technology
• Garbage Collection
• Wear Leveling
• TRIM
• Bad Block Management
• Power Shield (PS)
• Early Move

Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20°~75°.

For more information, please see Data Sheet